Engineer, Packaging Equipment & Tooling

About Ayar Labs

Ayar Labs is pioneering co-packaged optics (CPO) for AI infrastructure, using light instead of electricity to move data between chips. We design our TeraPHY™ optical I/O chiplets and SuperNova™ light sources in-house and, as a fabless company, partner with leading manufacturers to build them. Our Thailand team works on site at Fabrinet, our contract manufacturing partner, as the Ayar Labs technical owners of the products Fabrinet builds for us.

About the Role

Own the Ayar Labs packaging equipment and tooling inside our partner's facility, starting with qualifying a receptacle-attach tool, and keep it running at target uptime.

Key Responsibilities

• Install and qualify attach equipment; support the move to dedicated production tools.
• Design and procure fixtures, carriers, and tooling for multi-chip package (MCP) assembly.
• Develop recipes, calibration, and preventive maintenance; manage uptime and spares.
• Work with equipment vendors and partner teams on installation and issue resolution.
• Collect equipment data for yield and capability analysis.

Required Qualifications

• Bachelor's degree in mechanical, electrical, or mechatronics engineering.
• 3+ years in packaging, assembly, or semiconductor equipment engineering.
• Experience with automated placement or attach equipment, machine vision, and motion control.
• CAD skills for fixtures and tooling.
• Good written and spoken English; Thai language skills a plus.

Preferred Qualifications

• Active-alignment equipment experience (ADST or similar).

Work Environment

On site at our partner's facility, including cleanroom and ESD-controlled areas; occasional off-shift support during builds. May require some early-morning or evening calls with the US site located in San Jose, CA.