Senior Manager, HPS Front-End Manufacturing Engineering

Summary

As the Senior Manager of Front-End Manufacturing Engineering, you will lead the strategic alignment between early-stage product design and mass-production manufacturability for next-generation products and technologies. This role bridges the gap between top-tier chip design partners, internal Hardware engineering teams, and Manufacturing sites. You will be responsible for leading and scaling a team of high-performing engineers, driving SMT and Assembly Process Development to meet technology development roadmaps, mitigating technical risks via the NUDD framework, and ensuring seamless execution from concept to product qualification.

Detailed Description

1. People Management Team Leadership

• Talent Development & Mentorship: Directly manage, coach, and mentor a team of Front-End Manufacturing Engineers, fostering a culture of technical excellence, accountability, and continuous professional growth.
• Performance Management: Establish clear individual and team KPIs, conduct regular performance evaluations, and build tailored career development paths.
• Resource Planning & Allocation: Oversee team workload, headcount planning, and resource distribution to effectively support multiple parallel hardware development projects and operational timelines.
• Technical Oversight: Act as an escalation point to provide technical guidance, helping team members resolve complex engineering and manufacturing bottlenecks.

2. Early Engagement & DFx Strategy

• Design for Excellence: Lead and participate in comprehensive DFM/DFx reviews, providing technical solutions and mitigations to resolve manufacturing risks before design freeze.
• Co-Design Partner: Engage with design teams and architects in the early design phases to align component specifications with cutting-cutting-edge manufacturing capabilities.
• Ecosystem Partnership: Drive early-stage technology co-development and Level 2 qualification efforts with critical third-party partners and manufacturing sites.

3. Risk Mitigation & Technical Analysis (NUDD)

• NUDD Framework Execution: Evaluate New, Unique, Different, and Difficult (NUDD) processes against strict product technology requirements to identify potential yield and reliability detractors.
• Quality & Controls: Drive golden pFMEAs and define Critical-to-Quality (CTQ) parameters across new product lines.
• Failure Analysis: Interpret complex hardware product features and Failure Analysis (FA) results to generate comprehensive engineering and root-cause reports.

4. Advanced SMT Process Characterization

• Warpage & Thermal Management: Partner with operations to characterize complex PCB and large-form-factor BGA warpage behaviors.
• Process Optimization: Characterize and optimize reflow profiles and advanced stencil designs to support development phases and continuous operational improvements.
• NPI Prototyping Support: Provide hands-on engineering leadership during physical process builds, managing special build requirements and supervising deviation controls.

5. Technical Project Management & SME Leadership

• Cross-Functional Governance: Facilitate internal alignment meetings, manage action items, and maintain accountability across engineering disciplines.
• Stakeholder Communication: Serve as the primary technical point of contact for external customers, suppliers, and HPS teams, leading weekly synchronization on all related Front End Engineering activities.

Knowledge/Skills/Competencies

• People Management Experience: 5+ years of direct experience managing, building, and leading engineering teams within a highly technical hardware development or manufacturing environment.
• Industry Context: Direct experience collaborating with hyperscalers or tier-1 silicon providers (e.g., Nvidia, Broadcom, Marvell) is highly preferred.
• Technical Expertise: Deep understanding of DFx principles, pFMEA methodologies, reflow profiling, stencil design optimization, and BGA/PCB warpage characterization.
• Leadership & Soft Skills: Strong emotional intelligence with a proven track record of mentoring technical staff; exceptional project management skills with the ability to lead cross-functional matrixed teams and present technical milestones to executive stakeholders.

Physical Demands

• Incumbent will perform the duties of this position in a normal office environment.
• Duties may require periodic sustained visual concentration on a computer monitor or on numbers and other detailed data.
• May require occasional travel.

Typical Experience

8+ years of experience in Electronic Manufacturing, SMT Process Engineering, or NPI Leadership, with a proven track record handling large BGAs and high-density interconnect boards.

Typical Education

Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related technical field.
Educational requirements may vary by geography.

Notes

This job description is not intended to be an exhaustive list of all duties and responsibilities of the position. Employees are held accountable for all duties of the job. Job duties and the % of time identified for any function are subject to change at any time.Celestica is an equal opportunity employer. All qualified applicants will receive consideration for employment and will not be discriminated against on any protected status (including race, religion, national origin, gender, sexual orientation, age, marital status, veteran or disability status or other characteristics protected by law).At Celestica we are committed to fostering an inclusive, accessible environment, where all employees and customers feel valued, respected and supported. Special arrangements can be made for candidates who need it throughout the hiring process. Please indicate your needs and we will work with you to meet them.

COMPANY OVERVIEW

Celestica, Inc. (NYSE: CLS; TSX: CLS) is a technology leader dedicated to driving customer success and ma