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SiTime Corporation

Package Development Engineer

ประกาศจากแหล่งภายนอก
SiTime Corporation
วิศวกรรม
กรุงเทพมหานครทำงานที่ออฟฟิศลงประกาศ 4 ชม.ที่แล้ว
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Join SiTime as a Packaging Process Engineer focusing on QFN/LGA assembly technologies, responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing in a dynamic semiconductor environment.

รายละเอียดงาน

About SiTime

SiTime is the Precision Timing company.

Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.

Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry.

Job Summary

We are seeking a highly motivated and skilled Packaging Process Engineer to join SiTime in Thailand, focusing on QFN/LGA assembly technologies. In this role, you will be responsible for developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing. This is an excellent opportunity for a hands-on engineer to make a significant impact on cutting-edge semiconductor packaging technologies within a dynamic and innovative environment.

Responsibilities:

  • Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing and flip-chip bonding processes…
  • Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives to enhance yield, quality, and cost-efficiency.
  • Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues and defects.
  • Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer from development to high-volume manufacturing.
  • Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
  • Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
  • Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects.
  • Provide technical support and training for manufacturing operators and technicians.
  • Stay updated with the latest industry trends and advancements in packaging technologies.
  • 60% OSATs onsite (in Bangkok/Ayutthaya), 10% travel (Asia/US).

Qualifications & Requirements:

  • Bachelor, Master to PhD's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • Minimum of 5 years of experience in semiconductor packaging process engineering, specifically with strong knowledge of QFN/LGA and Flip-chip bonding technologies.
  • In-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).
  • Proficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.
  • Experience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).
  • Strong problem-solving skills and a data-driven approach to decision-making.
  • Excellent communication, interpersonal, and teamwork skills.
  • Ability to work independently and manage multiple projects simultaneously in a fast-paced environment.
  • Fluency in English is required.

Compensation Range:

At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.

In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.

Learn More about SiTime:

Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.

  • Innovation on Top – Philosophies of Innovation with Rajesh Vashist
  • Fabrication Knowledge – An Interview with Rajesh Vashist
  • SiTime Corporation – YouTube

สวัสดิการที่ได้รับ

โบนัสประจำปีโบนัสตามผลงานQuarterly bonusEquity grants

คุณสมบัติผู้สมัคร

ประสบการณ์
6-10 ปี
การศึกษา
ปริญญาตรี
ใบรับรอง / ทักษะเพิ่มเติม
Packaging process engineeringQFNLGAFlip-chip bondingWafer thinningDicingStatistical process controlSPCCp/Cpk analysis8D methodologyRoot cause analysisFailure analysisSEMEDXJMP
ภาษา
English· คล่อง

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